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Precision Motion Control Platform
Hollow Precision Die-Bonding Positioning Platform
Product Description
- Featuring a stacked layout, compact hollow structure, high-precision linear guides, high dynamic performance, and high precision. The Y-axis is driven by a dual-drive linear motor, with customizable travel, dimensions, cable configurations, and other specifications. The stacked, compact hollow-profile structure lowers the working point and positions the linear scale feedback closer to the work surface, making it particularly suitable for wafer inspection. The Y-axis is driven by a dual-drive linear motor, providing high thrust, speeds of up to 1 m/s, and precise positioning. This precision motion platform features a hollow structure, large through-hole, and high dynamic performance, making it suitable for wafer positioning and inspection applications as well as other advanced manufacturing applications such as CCD imaging and LED package inspection.
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