Products
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Precision Motion Control Platform
Wafer Cutting Platform
Product Description
- The platform features a precision linear guide, ultra-high straightness, an open-frame structure, low side height, optimized geometry, and high load-bearing capacity. The integrated XY direct-drive platform achieves horizontal straightness of less than ±1 μm and incorporates auxiliary features such as centralized oil lubrication and metal grounding. It is suitable for a wide range of semiconductor applications, including wafer dicing and wafer inspection. Based on customer requirements, the platform can be evaluated and customized according to stroke, load capacity, special structural requirements, and other specifications.
Product Detail Information
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