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This equipment is a vertical heating and curing oven developed for semiconductor, SMT, dispensing, and potting processes. By converting the conventional planar heating space into a three-dimensional heating structure, it reduces energy consumption and installation footprint while achieving high production efficiency.
The system provides production efficiency comparable to 20–35 m long tunnel-type heating furnaces while significantly reducing the required installation space.
A dedicated embedded control system, differentiated from conventional touchscreen and industrial PC-based systems, provides high stability and reliability. Various communication interfaces are also supported for convenient integration with other equipment and production systems.
Two independent temperature control zones allow both zones to operate in heating mode or one zone to operate in heating mode while the other operates in cooling mode, enabling a wide range of customized temperature conditions.
The conveyor chain is driven by a servo motor and incorporates a compensation function to account for thermal expansion and contraction of the chain under high-temperature conditions. This effectively prevents chain jamming and conveying errors caused by accumulated positional deviations.
The system supports recipe management for key process parameters and enables remote data monitoring and equipment integration through MES.
A proprietary horizontal and vertical air circulation structure, differentiated from conventional circulation methods, ensures uniform airflow throughout the chamber even when a large number of products are loaded.
The heating system incorporates three-stage safety protection to effectively prevent product damage and equipment malfunctions caused by overheating.
Designed with Class 10,000 cleanliness requirements in mind, the system is suitable for a variety of cleanroom production environments.
By applying an intelligent PID fuzzy control algorithm, the system delivers excellent thermal compensation and precise temperature control while effectively reducing energy consumption.
The system can be applied to a wide range of thermal processing applications, including pre-baking of products that generate chemical gases, residual stress relief of substrates, ink curing, and coating film drying.
